Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269559 | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer | Pulkit Agarwal, Richard Phillips, Purushottam Kumar, Adrien LaVoie | 2019-04-23 |