Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438916 | Wire bond connection with intermediate contact structure | — | 2019-10-08 |
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | John G. Meyers, Zhicheng Ding, Richard Patten | 2019-08-27 |
| 10332899 | 3D package having edge-aligned die stack with direct inter-die wire connections | Yi Xu, Florence R. Pon | 2019-06-25 |