Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325881 | Vertical semiconductor device having a stacked die block | Suresh Upadhyayula, Chin-Tien Chiu, Hem Takiar, Peng Chen | 2019-06-18 |
| 10249592 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Hem Takiar, Venkatesh Ramachandra, Vinayak Ghatawade +1 more | 2019-04-02 |
| 10200453 | Reverse seamless integration between local and remote computing environments | Georgy Momchilov, Modesto Tabares | 2019-02-05 |
| 10177128 | Semiconductor device including support pillars on solder mask | Chih-Chin Liao, Sung Tan Shih, Suresh Upadhyayula | 2019-01-08 |