Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490529 | Angled die semiconductor device | Hem Takiar | 2019-11-26 |
| 10325881 | Vertical semiconductor device having a stacked die block | Suresh Upadhyayula, Ning Ye, Hem Takiar, Peng Chen | 2019-06-18 |
| 10304816 | Semiconductor device including stacked die with continuous integral via holes | Shiv Shankar Kumar, Honny Chen | 2019-05-28 |
| 10242965 | Semiconductor device including interconnected package on package | Hem Takiar | 2019-03-26 |
| 10236276 | Semiconductor device including vertically integrated groups of semiconductor packages | Yangming Liu, Zhongli Ji, Shaopeng Dong, Zengyu Zhou | 2019-03-19 |
| 10177119 | Fan out semiconductor device including a plurality of semiconductor die | Cong Zhang, Fuqiang Xiao, Bin Xu, Haijun Wu, Zengyu Zhou | 2019-01-08 |