Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304816 | Semiconductor device including stacked die with continuous integral via holes | Shiv Shankar Kumar, Chin-Tien Chiu | 2019-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304816 | Semiconductor device including stacked die with continuous integral via holes | Shiv Shankar Kumar, Chin-Tien Chiu | 2019-05-28 |