Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522489 | Manufacturing process for separating logic and memory array | Michael Mostovoy, Emilio Yero, Gokul Kumar, Yan Li | 2019-12-31 |
| 10490529 | Angled die semiconductor device | Chin-Tien Chiu | 2019-11-26 |
| 10485125 | Integrated USB connector and memory device | Michael W. Patterson, Nandha Kumar Mohanraj | 2019-11-19 |
| 10381327 | Non-volatile memory system with wide I/O memory die | Venkatesh Ramachandra, Michael Mostovoy, Gokul Kumar, Vinayak Ghatawade | 2019-08-13 |
| 10325881 | Vertical semiconductor device having a stacked die block | Suresh Upadhyayula, Ning Ye, Chin-Tien Chiu, Peng Chen | 2019-06-18 |
| 10249592 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Venkatesh Ramachandra, Vinayak Ghatawade +1 more | 2019-04-02 |
| 10242965 | Semiconductor device including interconnected package on package | Chin-Tien Chiu | 2019-03-26 |