Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10236276 | Semiconductor device including vertically integrated groups of semiconductor packages | Yangming Liu, Chin-Tien Chiu, Zhongli Ji, Shaopeng Dong | 2019-03-19 |
| 10177119 | Fan out semiconductor device including a plurality of semiconductor die | Cong Zhang, Fuqiang Xiao, Bin Xu, Haijun Wu, Chin-Tien Chiu | 2019-01-08 |