Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249587 | Semiconductor device including optional pad interconnect | Han-Shiao Chen | 2019-04-02 |
| 10249592 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Hem Takiar, Venkatesh Ramachandra +1 more | 2019-04-02 |
| 10177128 | Semiconductor device including support pillars on solder mask | Sung Tan Shih, Suresh Upadhyayula, Ning Ye | 2019-01-08 |