Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10485111 | Via and skip via structures | Shao Beng Law, Nicholas V. LiCausi, James Jay McMahon, Ryan Smith, Xunyuan Zhang | 2019-11-19 |
| 10283372 | Interconnects formed by a metal replacement process | Sean Xuan Lin, Xunyuan Zhang, Mark V. Raymond, Nicholas V. LiCausi | 2019-05-07 |
| 10262892 | Skip via structures | Xunyuan Zhang, Frank W. Mont | 2019-04-16 |
| 10199261 | Via and skip via structures | James Jay McMahon, Ryan Smith, Nicholas V. LiCausi, Xunyuan Zhang, Shao Beng Law | 2019-02-05 |
| 10181421 | Liner recess for fully aligned via | Sean Xuan Lin | 2019-01-15 |
| 10177028 | Method for manufacturing fully aligned via structures having relaxed gapfills | Nicholas V. LiCausi | 2019-01-08 |
| 10170330 | Method for recessing a carbon-doped layer of a semiconductor structure | — | 2019-01-01 |