Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483254 | Electronic module and semiconductor package device | — | 2019-11-19 |
| 10438889 | Semiconductor package device and method of manufacturing the same | — | 2019-10-08 |
| 10411766 | Semiconductor package device and method of manufacturing the same | — | 2019-09-10 |
| 10381300 | Semiconductor device package including filling mold via | Jen-Chieh Kao, Yi-Chi Chen, Sung-Hung Chiang | 2019-08-13 |
| 10332849 | Semiconductor package device and method of manufacturing the same | Jen-Chieh Kao, Chih-Yi Huang, Fu-Chen Chu | 2019-06-25 |