Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515888 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu +1 more | 2019-12-24 |
| 10499802 | Mouth-opening device custom-made through 3-dimensional printing | Yi-Hung Pai | 2019-12-10 |
| 10409316 | Key device | Mitsuo Horiuchi | 2019-09-10 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Ting-Yu Yeh, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2019-05-28 |