Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2019-10-29 |
| 10439055 | IGBT with dV/dt controllability | Alexander Philippou, Christian Jaeger, Johannes Georg Laven | 2019-10-08 |
| 10347754 | Power semiconductor device with dV/dt controllability through select trench electrode biasing, and method of manufacturing the same | Alexander Philippou, Christian Jaeger, Johannes Georg Laven, Max Christian Seifert | 2019-07-09 |
| 10224206 | Bipolar transistor device with an emitter having two types of emitter regions | Roman Baburske, Christian Jaeger, Franz-Josef Niedernostheide, Hans-Joachim Schulze | 2019-03-05 |