| 10516064 |
Multiple width nanosheet devices |
Kangguo Cheng, Lawrence A. Clevenger, Junli Wang, John H. Zhang |
2019-12-24 |
| 10438850 |
Semiconductor device with local connection |
Kangguo Cheng, Lawrence A. Clevenger, Junli Wang, John H. Zhang |
2019-10-08 |
| 10431495 |
Semiconductor device with local connection |
Kangguo Cheng, Lawrence A. Clevenger, Junli Wang, John H. Zhang |
2019-10-01 |
| 10411128 |
Strained fin channel devices |
Kangguo Cheng, Junli Wang, Lawrence A. Clevenger, John H. Zhang |
2019-09-10 |
| 10395984 |
Self-aligned via interconnect structures |
Benjamin C. Backes, Brian Alexander Cohen, Joyeeta Nag |
2019-08-27 |
| 10387235 |
Statistical design with importance sampling reuse |
Rajiv V. Joshi, Rouwaida N. Kanj, Sani R. Nassif |
2019-08-20 |
| 10388639 |
Self-aligned three dimensional chip stack and method for making the same |
Lawrence A. Clevenger, Yiheng Xu, John H. Zhang |
2019-08-20 |
| 10374046 |
Structure for reduced source and drain contact to gate stack capacitance |
Richard Q. Williams |
2019-08-06 |
| 10347617 |
Self-aligned three dimensional chip stack and method for making the same |
Lawrence A. Clevenger, Yiheng Xu, John H. Zhang |
2019-07-09 |
| 10325778 |
Utilizing multiple layers to increase spatial frequency |
Lawrence A. Clevenger, John H. Zhang |
2019-06-18 |
| 10325777 |
Utilizing multiple layers to increase spatial frequency |
Lawrence A. Clevenger, John H. Zhang |
2019-06-18 |
| 10319870 |
Photovoltaic module with a controllable infrared protection layer |
Lawrence A. Clevenger, Timothy J. Dalton, Maxime Darnon, Rainer Krause, Gerd Pfeiffer +2 more |
2019-06-11 |
| 10319630 |
Encapsulated damascene interconnect structure for integrated circuits |
John H. Zhang, Lawrence A. Clevenger, Yiheng Xu |
2019-06-11 |
| 10304815 |
Self-aligned three dimensional chip stack and method for making the same |
Lawrence A. Clevenger, Yiheng Xu, John H. Zhang |
2019-05-28 |
| 10269905 |
Structure for reduced source and drain contact to gate stack capacitance |
Richard Q. Williams |
2019-04-23 |
| 10242911 |
Forming self-aligned vias and air-gaps in semiconductor fabrication |
Lawrence A. Clevenger, John H. Zhang |
2019-03-26 |
