Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388639 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2019-08-20 |
| 10361289 | Gate oxide formation through hybrid methods of thermal and deposition processes and method for producing the same | Wei Zhao, Shahab Siddiqui, Haiting Wang, Ting-Hsiang Hung, Beth Baumert +4 more | 2019-07-23 |
| 10347617 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2019-07-09 |
| 10319630 | Encapsulated damascene interconnect structure for integrated circuits | John H. Zhang, Lawrence A. Clevenger, Carl Radens | 2019-06-11 |
| 10304815 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2019-05-28 |
| 10211045 | Microwave annealing of flowable oxides with trap layers | Rishikesh Krishnan, Joseph K. Kassim, Bharat Krishnan, Joseph F. Shepard, Jr., Rinus Tek Po Lee | 2019-02-19 |