Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388565 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2019-08-20 |
| 10347541 | Active gate contacts and method of fabrication thereof | Jiehui Shu, David Paul Brunco, Pei Liu, Jinping Liu | 2019-07-09 |
| 10340146 | Reliability caps for high-k dielectric anneals | Rohit Galatage, Chung-Ju Yang | 2019-07-02 |
| 10211094 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2019-02-19 |
| 10170574 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2019-01-01 |