Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515880 | Lead frame with bendable leads | Zhigang Bai, Xingshou Pang, Meng Kong Lye, Xuesong Xu | 2019-12-24 |
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Burton J. Carpenter, Jinmei Liu, Mariano Layson Ching, Jr. +3 more | 2019-10-15 |
| 10290593 | Method of assembling QFP type semiconductor device | Zhigang Bai, Zhijie Wang | 2019-05-14 |
| 10217700 | Lead frame for integrated circuit device having J-leads and Gull Wing leads | Zhigang Bai, Xingshou Pang, Jun Li, Meng Kong Lye | 2019-02-26 |
| 10181434 | Lead frame for integrated circuit device having J-leads and gull wing leads | Xingshou Pang, Zhigang Bai, Meng Kong Lye | 2019-01-15 |