Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515880 | Lead frame with bendable leads | Jinzhong Yao, Zhigang Bai, Xingshou Pang, Xuesong Xu | 2019-12-24 |
| 10217697 | Semiconductor device and lead frame with high density lead array | Zhijie Wang, Zhigang Bai, You Ge | 2019-02-26 |
| 10217700 | Lead frame for integrated circuit device having J-leads and Gull Wing leads | Zhigang Bai, Jinzhong Yao, Xingshou Pang, Jun Li | 2019-02-26 |
| 10181434 | Lead frame for integrated circuit device having J-leads and gull wing leads | Xingshou Pang, Jinzhong Yao, Zhigang Bai | 2019-01-15 |