Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515880 | Lead frame with bendable leads | Jinzhong Yao, Xingshou Pang, Meng Kong Lye, Xuesong Xu | 2019-12-24 |
| 10290593 | Method of assembling QFP type semiconductor device | Zhijie Wang, Jinzhong Yao | 2019-05-14 |
| 10276208 | Data storage device coding out ambiguity in three-dimensional magnetic recording | Yaguang Wei, Terence Tin Lok Lam, Kuok San Ho, Lijie Guan | 2019-04-30 |
| 10217697 | Semiconductor device and lead frame with high density lead array | Zhijie Wang, You Ge, Meng Kong Lye | 2019-02-26 |
| 10217700 | Lead frame for integrated circuit device having J-leads and Gull Wing leads | Jinzhong Yao, Xingshou Pang, Jun Li, Meng Kong Lye | 2019-02-26 |
| 10181434 | Lead frame for integrated circuit device having J-leads and gull wing leads | Xingshou Pang, Jinzhong Yao, Meng Kong Lye | 2019-01-15 |