Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Burton J. Carpenter, Jinmei Liu, Jinzhong Yao +3 more | 2019-10-15 |