Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Jinmei Liu, Mariano Layson Ching, Jr., Jinzhong Yao +3 more | 2019-10-15 |
| 10325876 | Surface finish for wirebonding | Varughese Mathew, Leo M. Higgins, III, Chu-Chung Lee, Tu-Anh N. Tran | 2019-06-18 |
| 10249557 | Packaged integrated circuit device and methods | Leo M. Higgins, III | 2019-04-02 |
| 10242935 | Packaged semiconductor device and method for forming | Leo M. Higgins, III | 2019-03-26 |