Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522723 | Fan-out wafer level light-emitting diode package method and structure thereof | Kuo-Hsin Huang, Chung-Yu Chou, Yung-Hsiang Chao | 2019-12-31 |
| 10361352 | High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission | Chun-Der Wu, Kuo-Shu Tseng, Chih-Chiang Chang | 2019-07-23 |