Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361352 | High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission | Tzeng-Guang Tsai, Kuo-Shu Tseng, Chih-Chiang Chang | 2019-07-23 |