Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522723 | Fan-out wafer level light-emitting diode package method and structure thereof | Kuo-Hsin Huang, Tzeng-Guang Tsai, Yung-Hsiang Chao | 2019-12-31 |
| 10325368 | Optical measuring apparatus and operating method thereof | Long Hsu, William Wang, Cheng-Hsien Liu, Po-Chen SHIH, Ting-Sheng Shih +2 more | 2019-06-18 |