Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522723 | Fan-out wafer level light-emitting diode package method and structure thereof | Chung-Yu Chou, Tzeng-Guang Tsai, Yung-Hsiang Chao | 2019-12-31 |
| 10308461 | Roller assembly and method for transporting a substrate using the same | Chao-Feng Sung, Yu-Lin Hsu, Hsin-Yun Hsu | 2019-06-04 |