Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522723 | Fan-out wafer level light-emitting diode package method and structure thereof | Kuo-Hsin Huang, Chung-Yu Chou, Tzeng-Guang Tsai | 2019-12-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522723 | Fan-out wafer level light-emitting diode package method and structure thereof | Kuo-Hsin Huang, Chung-Yu Chou, Tzeng-Guang Tsai | 2019-12-31 |