Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418350 | Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure | Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale, Mark A. Gouker +1 more | 2019-09-17 |
| 10396269 | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits | William D. Oliver, Andrew J. Kerman, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker | 2019-08-27 |
| 10381541 | Cryogenic electronic packages and methods for fabricating cryogenic electronic packages | Eric A. Dauler | 2019-08-13 |
| 10242968 | Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages | Eric A. Dauler | 2019-03-26 |
| 10229897 | Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures | — | 2019-03-12 |
| 10199553 | Shielded through via structures and methods for fabricating shielded through via structures | William D. Oliver, Andrew J. Kerman, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker | 2019-02-05 |