Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396269 | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Mark A. Gouker | 2019-08-27 |
| 10199553 | Shielded through via structures and methods for fabricating shielded through via structures | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Mark A. Gouker | 2019-02-05 |