Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418350 | Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure | Rabindra N. Das, Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale +1 more | 2019-09-17 |
| 10396269 | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg | 2019-08-27 |
| 10199553 | Shielded through via structures and methods for fabricating shielded through via structures | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg | 2019-02-05 |