Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418350 | Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure | Rabindra N. Das, Chenson K. Chen, Keith Warner, Steven A. Vitale, Mark A. Gouker +1 more | 2019-09-17 |
| 10396269 | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Danna Rosenberg, Mark A. Gouker | 2019-08-27 |
| 10365670 | Variable thermal resistance | Reuel B. Swint, Gregory D. Allen, Todd A. Thorsen, Boris Kharas | 2019-07-30 |
| 10199553 | Shielded through via structures and methods for fabricating shielded through via structures | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Danna Rosenberg, Mark A. Gouker | 2019-02-05 |