Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381541 | Cryogenic electronic packages and methods for fabricating cryogenic electronic packages | Rabindra N. Das | 2019-08-13 |
| 10242968 | Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages | Rabindra N. Das | 2019-03-26 |