Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10329681 | Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire | Chi-Haw Chiang, Ren Fang, Chien-Liang Chang, Yu-Ping Wang, Ming-Ta Hsieh | 2019-06-25 |
| 10214663 | Chemical-mechanical polishing composition comprising organic/inorganic composite particles | Yongqing Lan, Bastian Marten Noller, Yuzhuo Li, Daniel Kwo-Hung Shen, Reza Golzarian | 2019-02-26 |