Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10478898 | Silver particles manufacturing method | Wu-Ching Hung, Wei-Jen Liu, Kuei-Ting Hsu, Jhao-Yi Wu, Pin-Chun Lin | 2019-11-19 |
| 10329681 | Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire | Chi-Haw Chiang, Liang Jiang, Ren Fang, Yu-Ping Wang, Ming-Ta Hsieh | 2019-06-25 |