Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510856 | Semiconductor device and method | Tetsu Ohtou, Ching-Wei Tsai, Chih-Hao Wang | 2019-12-17 |
| 10329681 | Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire | Chi-Haw Chiang, Liang Jiang, Ren Fang, Chien-Liang Chang, Yu-Ping Wang | 2019-06-25 |
| 10212997 | Collapsible umbrella with automatic closing structure | — | 2019-02-26 |