Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403535 | Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system | Zheng John Ye, Jay D. Pinson, II, Hiroji Hanawa, Jianhua Zhou, Xing Lin +11 more | 2019-09-03 |