Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10262911 | Circuit for and method of testing bond connections between a first die and a second die | Henley Liu, Myongseob Kim, Suresh Parameswaran, Cheang-Whang Chang, Boon Yong Ang | 2019-04-16 |