Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10302504 | On-die temperature sensing and digitization system | Boon Yong Ang, Ankur Jain | 2019-05-28 |
| 10262911 | Circuit for and method of testing bond connections between a first die and a second die | Yuqing Gong, Henley Liu, Myongseob Kim, Cheang-Whang Chang, Boon Yong Ang | 2019-04-16 |