Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068798 | Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrate | Hiroyuki Toshima, Shinji Furukawa, Naoki Watanabe, Naoyuki Suzuki | 2018-09-04 |
| 9976217 | Film forming method using reversible decomposition reaction | Atsushi Gomi, Yasushi Mizusawa, Masamichi Hara, Kaoru Yamamoto, Satoshi Taga | 2018-05-22 |