Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068798 | Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrate | Hiroyuki Toshima, Tatsuo Hatano, Shinji Furukawa, Naoki Watanabe | 2018-09-04 |
| 10049860 | Substrate processing apparatus | Atsushi Gomi, Tetsuya Miyashita, Shinji Furukawa, Koji Maeda, Masamichi Hara +2 more | 2018-08-14 |