Issued Patents 2018
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Li-Cheng Chu, Yuan-Chih Hsieh, Chun-Wen Cheng | 2018-01-23 |
| 9868628 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chun-Wen Cheng | 2018-01-16 |
| 9859819 | MEMS structure and method of forming same | Yi Heng Tsai, Kuei-Sung Chang | 2018-01-02 |