Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163874 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Scott M. Hayes | 2018-12-25 |
| 10143084 | Plated opening with vent path | Michael B. Vincent, Scott M. Hayes | 2018-11-27 |
| 10083912 | Method of packaging integrated circuit die and device | Wei Gao | 2018-09-25 |
| 10074614 | EMI/RFI shielding for semiconductor device packages | Scott M. Hayes, Michael B. Vincent | 2018-09-11 |
| 10068841 | Apparatus and methods for multi-die packaging | Wei Gao | 2018-09-04 |
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Jason Wright | 2018-02-20 |