Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Zhiwei Gong | 2018-02-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Zhiwei Gong | 2018-02-20 |