Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163874 | Packaged devices with multiple planes of embedded electronic devices | Zhiwei Gong, Scott M. Hayes | 2018-12-25 |
| 10143084 | Plated opening with vent path | Zhiwei Gong, Scott M. Hayes | 2018-11-27 |
| 10074614 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Scott M. Hayes | 2018-09-11 |
| 9960149 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Scott M. Hayes | 2018-05-01 |
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Zhiwei Gong, Jason Wright | 2018-02-20 |