Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163874 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Zhiwei Gong | 2018-12-25 |
| 10143084 | Plated opening with vent path | Michael B. Vincent, Zhiwei Gong | 2018-11-27 |
| 10074614 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Michael B. Vincent | 2018-09-11 |
| 9997492 | Optically-masked microelectronic packages and methods for the fabrication thereof | Weng F. Yap, Alan J. Magnus | 2018-06-12 |
| 9960149 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Michael B. Vincent | 2018-05-01 |