Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056360 | Localized redistribution layer structure for embedded component package and method | — | 2018-08-21 |
| 9997492 | Optically-masked microelectronic packages and methods for the fabrication thereof | Weng F. Yap, Scott M. Hayes | 2018-06-12 |