Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083912 | Method of packaging integrated circuit die and device | Zhiwei Gong | 2018-09-25 |
| 10068841 | Apparatus and methods for multi-die packaging | Zhiwei Gong | 2018-09-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083912 | Method of packaging integrated circuit die and device | Zhiwei Gong | 2018-09-25 |
| 10068841 | Apparatus and methods for multi-die packaging | Zhiwei Gong | 2018-09-04 |