Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2018-11-27 |
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI +1 more | 2018-11-06 |
| 10121965 | Resistive random access memory device containing discrete memory material portions and method of making thereof | Shiori Kataoka, Yusuke Yoshida | 2018-11-06 |
| 10121764 | Method for forming ball in bonding wire | Noritoshi Araki, Takashi Yamada, Teruo Haibara, Ryo OISHI | 2018-11-06 |
| 10115899 | Methods and apparatus for three-dimensional nonvolatile memory | Yusuke Yoshida, Tomoyuki Obu, Takeki Ninomiya, Toshihiro Iizuka | 2018-10-30 |
| 10089201 | Storage device, storage system and non-transitory computer-readable storage medium for mirroring of data | Hiroyuki Yamashita, Yasuhito Kikuchi, Yoshimasa MISHUKU | 2018-10-02 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI +1 more | 2018-02-06 |
| 9883588 | Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device | Keiichi Kimura, Kazuaki Kaneko | 2018-01-30 |