TY

Takashi Yamada

NM Nippon Micrometal: 5 patents #1 of 9Top 15%
NC Nippon Steel & Sumikin Materials Co.: 5 patents #1 of 31Top 4%
TO Toyota: 3 patents #403 of 3,405Top 15%
KM Konica Minolta: 2 patents #187 of 844Top 25%
IC Imasen Electric Industrial Co.: 1 patents #1 of 8Top 15%
LC Lapis Semiconductor Co.: 1 patents #8 of 55Top 15%
Overall (2018): #4,177 of 503,207Top 1%
12
Patents 2018

Issued Patents 2018

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10137534 Bonding wire for semiconductor device Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno 2018-11-27
10121764 Method for forming ball in bonding wire Noritoshi Araki, Teruo Haibara, Ryo OISHI, Tomohiro Uno 2018-11-06
10121758 Bonding wire for semiconductor device Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI +1 more 2018-11-06
10121531 Semiconductor memory 2018-11-06
10090539 Fuel cell system Tsuyoshi Maruo, Hiroyuki Imanishi, Mitsuhiro Nada 2018-10-02
10032741 Bonding wire for semiconductor device Daizo Oda, Motoki ETO, Teruo Haibara, Ryo OISHI, Tomohiro Uno +1 more 2018-07-24
10014539 Fuel cell system Yohei Okamoto, Hiroyuki Imanishi, Hiroyuki Suzuki 2018-07-03
9950663 Electronic vehicle horn Koichi Toyama, Toshihiko Kawamura 2018-04-24
9933742 Image forming apparatus and image forming system configured to control conveyance of a sheet to prevent deformation due to heating 2018-04-03
9893371 Fuel cell system Masashi Toida 2018-02-13
9891562 Image forming apparatus and conveyance control method Mikihiro Yamakawa 2018-02-13
9887172 Bonding wire for semiconductor device Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI +1 more 2018-02-06