Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Kazuyuki Saito, Tomohiro Uno | 2018-11-27 |
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Takashi Yamada +1 more | 2018-11-06 |
| 10121764 | Method for forming ball in bonding wire | Noritoshi Araki, Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2018-11-06 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Takashi Yamada, Teruo Haibara, Tomohiro Uno +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Kazuyuki Saito, Teruo Haibara, Takashi Yamada +1 more | 2018-02-06 |