Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Tomohiro Uno | 2018-11-27 |
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more | 2018-11-06 |
| 9995954 | Liquid crystal display device | Hideki Nishimura, Masato MAKI | 2018-06-12 |
| 9982402 | Paving construction method, pavement structure, and longitudinal groove forming instrument for pavement | Toshihiko Maeyama, Masanobu Sadayasu, Shinji Oba, Katsuji Suzuki | 2018-05-29 |
| 9922092 | Devices, systems, and methods for context management | Quentin Dietz, Jeremy Serfling, Edward Smith, Ahmad Abiri, Craig Mazzagatte +1 more | 2018-03-20 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Motoki ETO, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more | 2018-02-06 |