Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121758 | Bonding wire for semiconductor device | Daizo Oda, Kazuyuki Saito, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more | 2018-11-06 |
| 10032741 | Bonding wire for semiconductor device | Daizo Oda, Takashi Yamada, Teruo Haibara, Ryo OISHI, Tomohiro Uno +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Daizo Oda, Kazuyuki Saito, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more | 2018-02-06 |